Bin Feng is the Co-Founder and CEO of Microduino, an international company of makers and creators aimed at bringing easy-to- use electronics hardware to makers, designers, engineers, students and curious tinkerers of all ages and levels. Microduino presents the world’s smallest series of Arduino-compatible smart modules that are small, flexible, stackable and powerful, and can be used to create a limitless amount of DIY projects.
With over 13 years’ experience in technology and business, Bin has a passion for Microduino and is highly motivated to make the Microduino a huge success.
Bin holds Bachelor’s degree in Electronics Materials from Fudan Univ. , and Master’s degree in ECE from UCSD. His graduate research was for semiconductor device design, fabrication and characterization.